Failure modes such as delamination, voiding or solder bridging occur internally and cannot be easily seen yet opening a failed product may be impractical, or may destroy the fault evidence. Non-destructive inspection methods that generate high-resolution fault images are therefore essential for failure analysis. Southern Manufacturing & Electronics exhibitor Cupio has the expertise to deliver the solution.
Two complementary approaches exist: x-ray inspection and confocal scanning acoustic microscopy (CSAM). CSAM reveals air gaps, voids, and delamination in materials that x-ray cannot see, for example, delamination in a circuit board. Conversely, BGA ball voids are difficult to visualise with CSAM but easy with x-ray.
Both technologies can be accessed cost-effectively, without need to buy capital equipment, via an inspection and test house says Cupio. It has the latest equipment, backed by deep expertise on both technologies and how to apply them.
For example, the Nordson Dage GEN7 CSAM system offers one of the best ways of finding delamination and voiding faults, as well as structural and material problems. It can scan up to a large 350mm wafer chuck. With five independent motors, it offers six times the acquisition rate of earlier models, with 23% more scanning area to accommodate larger samples.
The Nordson Dage QUADRA 7 x-ray inspection machine provides 2D, CT and tomosynthesis x-ray modes. It has built-in tomosynthesis with a quick change to CT. It supports high resolution imaging with a 4k image of 100nm resolution.
It also has the Aspire FP detector which captures 6.7MP images at 30fps. These images are shown on two 4K UHD monitors (conventional HD monitors lack the resolution needed to show them).
Visit Cupio – Stand E110